The Dynachem (formerly Rohm & Haas, Morton) Conveyorized Vacuum Applicator model CVA 7025HP is an in-line unit designed and built to ensure complete elimination of air from the surfaces of a printed circuit panel as well as perfect encapsulation of the traces. CVA 7025HP has been developed for the simultaneous application on both sides of a printed circuit panel of dry film high-conformation, dry film soldermask and ConforMASK™, dielectric film and copper foil for SBU technology. The machine ensures a perfect adhesion of the dry film and a total lack of air bubbles. CVA 7025HP employs heat, vacuum and high pressure lamination. It is suitable for in-line or stand-alone mode operation. The machine is provided with a data management system to supervise and control the process.




  • Stainless steel construction–suitable for clean room operation
  • Greatly reduces dry film waste
  • Suitable for innerlayer or rigid panels–thickness range from 0.05-6.40 mm (0.002–0.250 in.)
  • Panel sizes up to 635 x 635 mm (25 x 25 in.)
  • It can run with 1 or 2 panels/cycle
  • High lamination pressure adjustable–from 1 to 3 kg/cm2 (14 to 42 PSI)
  • Dynamic and static slap down cycles
  • Max. lamination temperature 160°C (320°F) platen temperatures individually controlled high heating plate power
  • Completely controlled by PLC–operator interface in local language touch screen display
  • Convenient access to the vacuum chamber for cleaning or maintenance operations
  • Output panel temperature detected


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