FIFO (First-In-First-Out) Buffer SLC20+
Highlights
Suitable for buffer solutions of single panel between any kind of processes
- Capacity loading and unloading max. 4 panels/min.
- Capacity: Basic version for 20 PCB/ substrates prepared for up to 50 PCB/ substrates
- Signal exchange to upstream and downstream process machines
- Data management per panel*
- Multi-job handling*
- DMC reader and connection to MES as well as automatic order management*
- Cooling by directed air flow for each storage position*
Description
With the FIFO (First-In-First-Out) buffers, 20-50 inner- and outer layers can be buffered according to the chaotic warehouse management principle – in order to comply with downtimes of downstream processes or to maintain holding times after upstream processes. When an order management system is integrated, orders in the buffer can also be reprioritized. Via a lifting axle with transport device each floor of the buffer can be approached in any order. The buffer can be placed space-savingly inline between processes, so that a continuous operation (without using the buffer) is possible without any additional space requirement. An optional integrated cooling extends the area of application of the buffer
