Highlights
- Suitable for flex circuits, inner and outer layers in the thickness range of 0.05 x 3.2 mm
- High lamination pressure adjustable up to 7 kg/cm2 (399,1 PSI)
- Dynamic and static pressure increase for optimal lamination
- State-of-the-art vacuum technology
- Oil or dry pump available
- Heating plates in vacuum range with double zone for better temperature uniformity
- OMRON PLC and user interface in the local language
- Automatic upper plate release & opening by servo motor cylinder
- Over 100 recipes can be managed
- Optional: Statistical process control
- Modular design intended for inline production
Description
The vacuum laminator is designed and built to avoid air inclusions on the surfaces and achieve the perfect air-free encapsulation of the structures of a printed circuit board, IC substrate, semiconductors, solar cells. The machine can be operated on one or two sides to achieve high lamination quality and excellent embedding of fine structures with dry film photoresist, dry film soldering mask, ConforMASK dielectric film, copper foil for SBU technology, top layer and many other film layup applications. The machine ensures perfect adhesion of the film and eliminates air bubbles. The combination of heat, vacuum and high lamination pressure is determined in the overall cycle. The machine has a data management system for controlling and recording the process parameters according to the latest software and hardware technology.
