Flip-Buffer for Inner- and Outerlayer

Economical solution for the temporary storage and turning of inner and outer layers.

Highlights

  • Optional: Integration of cooling air fans
  • Capacity: approx: 8 printed circuit boards/min

Description

Up to 30 inner or outer layers can be stored (cooled) and flipped in this hedgehog buffer. Sensors protect against overlapping and PCB damage. Depending on the process, the printed circuit boards are supported with a rod made of PE or teflon.

Our partners

Logo DYNACHEM
Logo NOTION