Vaccum applicator VA-7224-HP7
Highlights
- Stainless steel construction suitable for cleanroom operation
- Suitable for material thicknesses of 0.05 x 6.40 mm thickness
- Dynamic and static pressure profiles are freely programmable
- High lamination pressure adjustable up to 7 Kg/cm2
- Significantly reduces material consumption
- Panel sizes up to 610 x 610 mm
- High-temperature film release roll-to-roll for top
- Maximum lamination temperature 180°C plate temperature is individually controlled
- Total plate area can be filled with one or more plates
- State-of-the-art vacuum technology
- Fully controlled by Omron -SPS
- Upper plate opening via geared motor for user-friendly access to the vacuum chamber in case of cleaning or maintenance work
*optional
Description
The Vacuum Laminator -HP7 is designed and built to avoid air inclusions on the surfaces and achieve the perfect air-free encapsulation of the structures of a printed circuit board, IC substrate, semiconductors, solar cells. The machine can be operated on one or two sides to achieve high lamination quality and excellent embedding of fine structures with dry film photoresist, dry film soldering mask, ConforMASK dielectric film, copper foil for SBU technology, top layer and many other film layup applications. The machine ensures perfect adhesion of the film and eliminates air bubbles. The combination of heat, vacuum and high lamination pressure is determined in the overall cycle. The machine has a data management system for controlling and recording the process parameters according to the latest software and hardware technology.
